Top 10 Best Heat Sink Compound

Auto Truck Maintenance. Model Number 98003. Item Package Dimension 18.0 L x 18.0 W x 21.0 H. Item Package Weight 1.01 lb.

Size 1 oz. tube. Thermal Conductivity 1.8X10e-3Calcm. sec. K. Volume Resistivity 2X10e15Ohm.cm. Family 10-8109. Dielectric Constant 4.9.

Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application. High efficient thermal conductive properties. High temperature stability. Use with heat sinks or metal chassis. Contains zincs oxides and polydimenthyl siloxane.

Ceramic-based compound containing silicone. Thermal conductivity of more than 1.066 Wm-K.

Highly filled w metal oxides for high thermal conductivity.. Non-curing, does NOT need curing and does NOT harden.. HydrophobicWater Resistant. Non-sag, nonflowable, stays in place.. Stable at high temperatures..

Better Than Liquid MetalSuper carbon nano-grade super thermal conductive silicone grease. Thermal conductivity 5.15 Wm-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.. Safe For You And Your PCStrong insulation performance, withstand voltage above 10,000 volts.. Easy to UseThermal paste has ideal consistency and is very easy to use even for beginners.. High DurabilityLow thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30-280 environment. High heat dissipation performance, high-cost performance. It will not compromise over time.. Safety ApplicationSuitable for CPU radiator or chip. High-temperature resistance, low thermal resistance, and high conductivity can achieve excellent heat transfer. Suitable for CPU, VGA, chipset, and other PC components..

High stability and reliability polysynthetic thermal compound which improve the thermal conductivity of contact surface, ensure the heat dissipated quickly and efficiently.. Not electrically conductive and non-corroding thermal grease which eliminates any risks of causing short circuit.. Balance thermal resistance and viscosity can keep mushy for a long time, which enhance wettability, at least 5 years last without additional apply again.. Widely used for CPU, GPU, Coolers, IC Processor, Heatsink and DIY heat dissipation devices, suitable for beginners.. Easy to apply and easy to clean with dry paper towel or tissue no cleaning alcohol required..

UNIQUE PERFORMANCE high thermal conductivity 12.8 Wm.K, balance thermal resistance and viscosity can keep mushy for a long time, which enhance wettability and improve the thermal conductivity of contact surface, ensure heat dissipated quickly efficiently.. SAFE APPLICATION non-volatile, flame retardant, metal-free and non-conductive, which eliminates the risk of short circuit and discharges and corrosion damage to the radiator bottom.. HIGH DURABILITY high stability reliability polysynthetic thermal compound, at least 5 years last without addtional apply again.. EASY TO USE widely used for CPU, GPU, Coolers, IC Processor, Heatsink and DIY heat dissipation devices, suitable for beginners.. WHAT YOU GET 3 grams silicon thermal compound, spatula, scraper, clean package. Refund Replacement services if delivery damanged..

Working principle Fill the gap between heating element and the cooling device. Increase the contact area, so as to achieve the soundest effect of thermal conductivity.. Non-Electrical Conductive, High temperature resistance, Non-toxic, Non-corrosive.. Suitable for CPU, GPU ,heatsink, ovens, chipset, Xbox, High power LED and other components.. Thermal Conductivity 1.63Wm-k, Thermal Resistance 0.249C-in2W, Net Weight 100grams. Package Includes 1 x GENNEL G104 100g White thermal grease paste, 1 x Thermal paste spatula.

EXCELLENT STABILITY STC 8 thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity 8.3 Wm-k.. MEASURING GRADUATION Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.. OPTIMAL VISCOSITY Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 350-480 Pa.s.. EASY TO USE AND STORE Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed. OUTSTANDING DURABILITY Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance RoHS Certified.