Top 10 Best Heat Sync

100x25x10mm silver tone aluminum heatsink heat sink cooling fin, ideal to be used for cooling LED, Power IC, Power Amplifier,and Transistors etc.. Size 100 x 25 x 10mm3.94 x 0.98 x 0.39inchL x W x H.. Material Aluminium Color Silver Tone Fins Number 8.. Base Board Thickness 4.2mm Pin Board Thickness 1.5mm1.8mm for two pin boards outside.. Package Content 5 x Silver Tone Aluminium Heatsink Cooling Fin..

Designed for M.2 SSD-The heat sink is specially designed for M.2 2280mm SSD, which is very suitable for desktop computersPlaystation 5, etc.. Double-sided cooling- Aluminum alloy-Groove design, greatly increase the heat dissipation area, with 10C - 30C cooling effect Varies depending on the environments, cool your M.2 SSD to a safe temp to avoid overheating and throttling, improving the performance of your computer.. Easy to Install and Operate - With double-sided clip design, 6 adjustable height screws, suitable for M.2 SSD of various heights, stable installation, better protection of your M.2 SSD.. Unique Nano Thermal Pad- Advancing Gene thermal pad is made from Nano Silicon Grease Material, with good thermal conductivity ability. Soft enough and good ductility, compatible with uneven surfaces of the M.2 SSD. Low viscosity, with no damage to the SSD warranty label.. Fine Workmanship- Main body material Aluminum alloy, silver plating Helps eliminate static electricity, anodic oxidation surface treatment. Dimensions 3 x 0.95 x 0.4in., net weight 1oz., minimum installation height requirement 12mm..

1. Material 40mm heat sink anodized aluminum balck. 2. Dimension 40x40x11mm 1.57 x 1.57 x 0.43 inch LWH. 3. Pre-applied blue thermal conductive adhesive tape backing, sticks well, flat, burr-free cuts. 4. This 40mm heatsink kit is suitable for cooling applications such as 3D printer stepper motor NEMA17, gpu backplate, PC chipset, power IC, power electric device, TEC1-12706 Thermoelectric module, LED light devices etc. Can be used with other devices to cool processors, regulators, etc.. 5. Weight 0.63 oz 18 gr per pc.

Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations. Wide-range PWM fan with unique wave-shaped blade design for excellent airflow. CPU Socket LGA2066, LGA2011-v3, LGA2011, LGA1366, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150, AM4, AM3, AM3, AM2, AM2, FM2, FM2, FM1. Dimensions L x W x H 120 x 80 x 159 mm 4.7 x 3.1 x 6.3 inch Heat Sink Dimensions L x W x H 116 x 51 x 159 mm 4.6 x 2.0 x 6.3 inch Fan Dimensions L x W x H 120 x 120 x 25 mm 4.7 x 4.7 x 1 inch. Heat Sink Material Aluminum Fins, 4 Direct Contact Heat Pipe Heat Sink Weight 465g 1.03lb Heat Pipe Dimensions 6mm. Fan Noise Level 9 - 36 dBA Fan Speed 600-2000 RPM PWM 10 Fan Airflow 24.9 - 82.9 CFM 10.

100pcs small to medium sizes of heat sink.. Small anodized Aluminium 20pcs 9x9x5mm, 8pcs 10x10x10mm, 8pcs 11x11x5mm LWH. Medium anodized Aluminium 8pcs 14x14x7mm, 8pcs 19x19x5mm, 8pcs 20x20x6mm, 2pcs 22x22x10mm LWH. Silver Tone Aluminium 20pcs 7x7x6mm, 10pcs 8.5x8.5x8mm, 8pcs 15x15x6.5mm LWH. Can be used for cooling of variety of electronics components such as Development Boards VRAM VRM CPU GPU VGA RAM IC Chips LED Laptop MOSFET Transistor SCR Southbridge Northbridge Voltage Regulators m.2 SSD NVMe 2280 2242 22110 modules..

Interface PCIe Gen4 NVMe 1.4. Speed on PS5 Under the operating environment of the PS5, the sequential read speed of both 1TB and 2TB models measured at 6100MBs To be able to work on PS5, PS5 firmware 21.02-04.00.00.42 or higher is required. Speed on PCLaptop Sequential RW up to 74006800MBs Test performed in ADATA internal lab, actual performance varies by paired system and testing environment. When paired with PCie 3.0 port, max RW will be limited to 34003000MBs. Form factor M.2 2280 This drive will only work with MB that supports PCIe 4 PCIe 3 backward compatible. The drive is designed to work with direct installation onto MB, it may not work with external enclosure. Backed by a 5-year limited manufacturer warranty.

Includes 10 pcs black anodized aluminum heatsink. Pre-applied thermal conductive adhesive tape backing. Can be applied for passive cooling of LED, FPV transmitter, Vram, RAM, IC Chips, etc.. Dimension 0.79 x 0.79 x 0.39 inch 20mm x 20mm x 10mm LWH. Weight 0.25 oz 7 gr per pc.

Reduce the risk of hardware failure due to overheating.. Heatsink Size 5.9 x2.71 x 1.41 150mm x 69mmx 36mm.. Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.. Maximize surface area Designed in contact with the cooling air. The 27pcs fins increase the area of the board and thus provide for greater heat transfer. For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible..

Includes 12 peices 40mm golden-tone aluminum heatsink. Dimension 40mmx40mmx11mm 1.6' x 1.6' x 0.43'LWT. Unit Wieght 18.5grpc. Can be applied with stepper motors of 3D printers, nema 17, TEC1-12706 TEC1-12710 Thermoelectric Peltier Cooler etc.

black anodized aluminum heatsink Exquisite workmanship, good heat dissipation, long service life.. Small in size, light in weight, size approx. 8.8 x 8.8 x 5mmLWH. Weight 0.03 oz 0.9 gr per piece. Can be applied for passive cooling of Stepper Drive, MOSFET, VRM, Vram, IC Chips raspberry pi models pi electronics, computers, electrical appliances, and heat dissipation etc.. 60pcs Small Mini Heatsink Kit1 thermal adhesive..