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MG Chemicals - 4860P-35G 4860P 63/37 No Clean, Leaded Solder Paste, 35 g (1.2 oz) Pneumatic Dispenser (Complete with Plunger & Dispensing Tip)
No Clean Flux Residues are Non-corrosive, Non-conductive. Easily Dispensed. Excellent Wettability. Ideal for surface mount applications. Complete dispensing unit.
Chip Quik NC191LT10 Smooth Flow Low Temp Solder Paste Sn42/Bi57.6/Ag0.4 T4 10g Syringe
Smooth Flow. Low Temp Solder. Halogen Free. Lead-Free. RoHS Compliant.
Chip Quik SMD291AX Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g
Solder Paste. Leaded. No Clean. Syringe.
SRA Soldering Products Rosin Paste Flux #135 In A 2 oz Jar
The ideal flux for electrical and electronic repairs. Contains 2 ounce in a Hockey puck Jar. Formulated for use with tinlead and lead-free alloys. Dimensions 2.5 Dia x 1 H 64 x 25.5 mm. Does not need to be cleaned. Active temperature range 93 315c 200 600. Made in USA.
Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F
Solder Paste. Lead Free RoHS. No Clean. Syringe. Low Temprature.
Fast Silver Solder Paste with Flux, 1/4-oz Syringe, Lead-Free, Cadmium-Free, Made in USA
Flowing at 430 F, heated by a soldering iron or torch. Extremely strong joint, NO need for additional fluxing. Lead-free, cadmium-free. Creates a clean, tarnish-free, silver-color joint. Made in the USA.
Chip Quik NC191SNL50 Smooth Flow Lead-Free Solder Paste SAC305 T4 50g Jar
Smooth Flow. SAC305. Halogen Free. Lead-free. RoHS Compliant.
No Clean SnPb Leaded Solder Paste 15 Grams
Leaded Solder Paste. T4 new industry standard. 183C 361F Melting Point Eutectic. Two dispensing tips 16g and 20g. 63Sn37Pb.
Kester EP256 Solder Paste, No-Clean 63/37, Syringe Dispenser (1)
Packed as pictured. 8cc syringe contains 35 grams of solder paste. Kit Includes five 19-gauge dispensing tips 0.033 inside diameter. 6337 TinLead, the most common for electronics work. No-clean flux formula.
MG Chemicals - 8341-10ML 8341 No Clean Flux Paste, 10 milliliters Pneumatic Dispenser (Complete with Plunger & Dispensing Tip)
Superior fluxing ability. Instant wetting. After soldering, the rosin residue is non corrosive, non conducting, moisture resistant, and fungus resistant. Compatible with lead free and leaded solder systems. Thixotropic paste RoHS compliant.