Top 10 Best Thermally Conductive Epoxy

of November 2024
1
Best ChoiceBest Choice
MG Chemicals - 8329TFF-25ML 8329TFF Thermally Conductive Adhesive - Fast Cure
MG Chemicals
MG Chemicals
10
Exceptional
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2
Best ValueBest Value
GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster,
GENNEL
GENNEL
9.9
Exceptional
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3
MG Chemicals 832TC-450ML Thermally Conductive Epoxy Encapsulating and Potting
MG Chemicals
MG Chemicals
9.8
Exceptional
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4
MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4
The Epoxy Experts, MAX EPOXY SYSTEMS
The Epoxy Experts, MAX EPOXY SYSTEMS
9.7
Exceptional
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5
MG Chemicals 8329TCS Thermally Conductive Adhesive - Slow Cure Epoxy, 50 mL,
MG Chemicals
MG Chemicals
9.6
Exceptional
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6
Easycargo 10gram Thermal Conductive Glue Kit, High Performance Silicone Thermal
Easycargo
Easycargo
9.5
Excellent
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7
MG Chemicals 8330S Silver Epoxy Adhesive, Extreme Conductivity, 4 hr. Working
MG Chemicals
MG Chemicals
9.4
Excellent
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8
MG Chemicals - 8329TFF-50ML 8329TFF Thermally Conductive Adhesive - Fast Cure
MG Chemicals
MG Chemicals
9.3
Excellent
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9
MG Chemicals 8329TFS Thermally Conductive Adhesive - Slow Cure, 25mL Dual
MG Chemicals
MG Chemicals
9.2
Excellent
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10
MG Chemicals 834FX Flame-Retardant Thermally Conductive Flexible Epoxy for
MG Chemicals
MG Chemicals
9.1
Excellent
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About Thermally Conductive Epoxy

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MG Chemicals - 8329TFF-25ML 8329TFF Thermally Conductive Adhesive - Fast Cure Epoxy, 25 mL Dual Dispenser

Thermal conductivity of 0. 8 WmK. 11 mix ratio. Working life 4 minutes, set time 15 minutes. Cure time 3 hours at room temperature or 15 minutes at 65 c 149 f. Flame retardant UL 94V-0 registered.

GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance

Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.. Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.. It has good thermal conductivity and wide service temperature range-60250 degrees Celsius. Thermal conductivity 1.5Wm-K, Do not use thermal glue between CPU and HEATSINK. Package Includes 1 x GENNEL G109 10g thermal glue.

MG Chemicals 832TC-450ML Thermally Conductive Epoxy Encapsulating and Potting Compound, 15 oz Kit, Black

Excellent electrical and thermal conductivity. Easy 11 mix ratio. Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons. Suitable for large production runs. Excellent machining properties.

MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits, Read Description Below

Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation. Large Mass, Thick Cross-Section, Low Exothermic Heat Generation. Lower Viscosity Compared To Other Thermally Conductive Potting Compound. Insulates ACDC Current, Suitable For High And Low Voltage Insulating. Long Working Time - Cures In 24 Hours 25C- Heat Curable For Faster Processing.

MG Chemicals 8329TCS Thermally Conductive Adhesive - Slow Cure Epoxy, 50 mL, 2-Part Kit

Excellent 1. 44 Wmake thermal conductivity. Easy 1 1 mix ratio with 4 hour pot life. Adheres to most electronic substrates. Stores and ships at room temperature - no freezing or dry ice required. Very long shelf life of at least two years - even when stored at room temperature. Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons.

Easycargo 10gram Thermal Conductive Glue Kit, High Performance Silicone Thermal Plaster Adhesive Glue, Cooler Epoxy Compound for Heatsink GPU VRM VRAM LED IC Chips MOSFET BJT Transistor 3D Printer PCB

10 gram high performance thermal glue with strong adhesion.. Thermal conductivity 0.975 wmk. Thermal Impedance 0.06. Non-Electrical Conductive. Premium thermal conductive glue for bonding the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, etc.

MG Chemicals 8330S Silver Epoxy Adhesive, Extreme Conductivity, 4 hr. Working time, 21 g, 2 Dispeners (8330S-21G)

Excellent 0.0007 cm electrical resistivity and 2.4 WmK thermal conductivity. Easy 11 mix ratio and long working time may be mixed once and then used as a 1-part epoxy for a four hour production shift. Heat Cure is Required. Cure temperature of only 65 C for 2 hours lower than most 1-part epoxies and suitable for use on heat sensitive components.. Very long shelf life of at least two years even when stored at room temperature. Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons.

MG Chemicals - 8329TFF-50ML 8329TFF Thermally Conductive Adhesive - Fast Cure Epoxy, 45 mL Dual Cartridge

Thermal conductivity of 0. 8 WmK. 11 mix ratio. Working life 4 minutes, set time 15 minutes. Cure time 3 hours at room temperature or 15 minutes at 65 c 149 f. Flame retardant UL 94V-0 registered.

MG Chemicals 8329TFS Thermally Conductive Adhesive - Slow Cure, 25mL Dual Dispenser

Thermal conductivity 1. 22 WM K. Working life of 4 hours. Cure time of 1 hour 20 minutes at 80 C or 96 hours at room temperature. Dual Dispensing Unit. Dispensing Gun sold separately cat 8DG-50-1-1.

MG Chemicals 834FX Flame-Retardant Thermally Conductive Flexible Epoxy for Electronics, Black, 450 mL Kit, 15 fl. oz kit

Flexible. Meets UL 94V-0 standardflame retardant. Broad service temperature range -50 to 150 c -58 to 302 f. High elongation. Low tg of 0.7 c 33 f.
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